| 摘要 |
PURPOSE:To improve the moistureproofness and to enhance the reliability by a method wherein, after a passivity film has been formed on a bonding pad, a wire for external extraction use is connected by an ultrasonic bonding method. CONSTITUTION:A bonding pad 2 is formed on a semiconductor substrate 1; a passivity film 3 is formed on the surface of the bonding pad 2. The surface of this passivity film 3 is exposed; an insulating protective film 4 covering the semiconductor substrate 1 is formed; a wire 5 is connected to the surface of the passivity film 3 by an ultrasonic bonding method. When the bonding pad 2 is formed by using aluminum, the passivity film 3 can be formed if the surface of the bonding pad 2 is immersed in warm wafer of about 60 deg.C for 10 minutes. After the passivity film 3 has been formed, one end of the wire 5 is connected by the ultrasonic bonding method under a condition of 20 kHz at 1 W. |
