| 摘要 |
<p>PURPOSE:To transfer an electronic component stably and continuously after its formation by a method wherein a belt for body transfer use is added to a belt for lead-wire transfer use, a stuck foreign substance is removed by sliding a plate brought into contact with a side of a metal mold forward and backward after each lead formation process and a lead wire is pushed out surely. CONSTITUTION:A lead of an electronic component 4 which is transferred inside a device by a lead-wire transfer belt 3 and an electronic component body transfer belt 6 is formed by using a lead-wire cutter 1 moving upward and downward in a forming position, a lead-forming pin 2 and a forming metal mold 5. When the component is transferred from the forming position, a plate 7 which is interlinked synchronously with a lever 10a and a wire 9 is moved in a transfer direction of the electronic component 4, removes a stuck foreign substance (a residuary substance of a solder) and pushes out a lead wire. After completion of this operation, the plate 7 is returned to its former position by a compression spring 8.</p> |
