| 摘要 |
PURPOSE:To prevent disorder in patterns on the peripheries of big penetrated holes due to inflow of the air into the big penetrated holes by a method wherein, after the printing of the patterns including through holes is subjected to vacuum printing, the peripheries of the big penetrated holes are printed at normal pressures. CONSTITUTION:An Al substrate 11 structurally has penetrated holes 12, which are not subjected to through printing, and through holes 13. Moreover, patterns 14 and 15 are formed by printing. The printing of a thick film printed substrate is executed by a method wherein after the patterns 14 including the through holes upper than X1-X1' directions and connection points 16 are printed at a negative pressure, the patterns 15 not including the through holes lower than X2-X2' directions and the connection points 16 are printed at normal pressure and the patterns 14 and 15 and the connection points 16 are fired simultaneously. Accordingly, disorder generated in the patterns on the peripheries of the big penetrated holes is eliminated and an integration degree can be improved.
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