Method for producing a lead frame for semiconductor devices

摘要

A method is specified for producing a lead frame for semiconductor devices. A lead frame in this case has at least one frame element, a semiconductor-element mounting section which is implemented in one piece therewith, and a plurality of lead wires which are arranged around the semiconductor-element mounting section at a distance therefrom and are implemented in one piece with the frame element. A binding metal is metallized onto a specific part of a metal foil, which part includes at least those sections which correspond to the semiconductor-element mounting section and the inner conductor sections of the lead wires. The metal foil onto which the bonding metal is metallized is then used to produce the lead frame. This method avoids, on the one hand, widening, by the lateral surfaces of the internal conductor sections, of the metallization towards the outside of the metallization region and, on the other hand, every deformation of the semiconductor-element mounting section and of the internal conductor sections. <IMAGE>