| 摘要 |
PURPOSE:To suppress an intrusion of an impurity from a printed-circuit board as far as possible by a method wherein, while the printed-circuit board where a minimum pattern required for a mounting operation has been formed is in a semimanufactured stage, a chip is mounted, connected parts including the chip are coated with a resin and, after that, remaining patterns are formed on the printedcircuit board. CONSTITUTION:Minimum patterns 3a required for a mounting operation are formed on a printed-circuit board 1. After said patterns 3a have been formed, the printed-circuit board is washed. Then, a chip 4 is mounted. For this.mounting operation, a wire bonding operation using a wire is executed; after that, a synthetic resin 6 is coated and a baking operation to harden the resin is executed immediately. Said process is executed in an air-conditioned clean room. Lastly, remaining patterns 3b to be connected electrically to said patterns 3a are formed on the printed-circuit board. When said patterns 3b are to be formed, it is appropriate to use a multiwire process to form a circuit in such a way that an insulation-coated copper wire is guided lengthwise and crosswise and that a hole is made in a position to be connected finally in order to form a connection by plating a through hole.
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