发明名称 MANUFACTURE OF MULTILAYER INTERCONNECTION MATERIAL
摘要 PURPOSE:To enhance the step coverage of a conductive film by a method wherein a liquid metal complex is coated on an insulating film, a metal is precipitated in a prescribed region, the conductive film is formed and the liquid metal complex in a region where the metal is not precipitated is removed so that the liquid metal complex is coated faithfully along a stepped shape in a base by means of fluidity of the liquid metal complex. CONSTITUTION:A liquid metal complex MCP in which a silver halogenide such as AgI or the like is suspended in the form of fine crystals singly or as a mixture is coated on the surface of an interlayer insulating film IC. While a device is placed on a rotary table and is rotated, the complex MCP is dropped in the central part of rotation and is coated while the complex is stretched toward the circumference by a centrifugal force. The coated complex MCP is dried; the liquid metal complex MCP in an optical black part OB is exposed to light selectively; a latent image is formed. The complex MCP is developed and silver is precipitated selectively in the optical black part OB. In order to secure the light-shielding performance of a light- shielding film SF, the silver is precipitated with a film thickness of about 1 mum. The complex MCP is fixed; the complex MCP in an unexposed part is removed; the light- shielding film SF composed of silver is formed.
申请公布号 JPS63266870(A) 申请公布日期 1988.11.02
申请号 JP19870099736 申请日期 1987.04.24
申请人 HITACHI LTD 发明人 TANAKA KIYOSHI;HAYASAKA AKIO
分类号 H01L21/3205;H01L27/14;H01L27/146 主分类号 H01L21/3205
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