| 摘要 |
PURPOSE:To enhance the light-shielding performance by a method wherein an output signal line is installed in a region which is different from a vertical scanning line so that a step coverage of a lightshielding film can be enhanced. CONSTITUTION:Output signal lines HS2, HS4,... which are extended in the row direction are connected in nearly the central part of solid-state image sensor which are arranged in the row direction and at the upper part of a region which is different from vertical scanning lines VL in an intermediate conductive layer HL2 of an optical black part OB; they are connected to the intermediate conductive layer ML2 through connecting holes C3. A light-shielding film SF is installed at the upper part of the output signal lines HS by laying an interlayer insulating film (e.g., a PSG film) in between. Because the output signal lines HS2, HS4,... are installed in a region which is different from the vertical scanning lines VL which are extended at the upper part of the solid- state image sensor of the optical black part OB, a stepped shape caused by the vertical scanning lines VL and the output signal lines HS is reduced; the surface of the interlayer insulating film IC as a base can be flattened; accordingly, a step coverage of the light-shielding film SF is enhanced; the light-shielding performance of the light-shielding film SF can be enhanced. |
