发明名称 LOW EXPANSION COPPER ALLOYS WITH HIGH THERMAL CONDUCTIVITY
摘要 The present invention relates to copper-iron-nickel composite materials having utility in electronic applications because of their low coefficients of expansion and high thermal conductivities. Composite materials in accordance with the present invention consist essentially of about 10% to 80% copper and the balance iron plus nickel with the ratio of iron to nickel being in the range of from about 1.5:1 to about 2.0:1. Preferred composite materials have an iron to nickel ratio in the range of from about 1.6:1 to about 1.9:1.
申请公布号 AU1487588(A) 申请公布日期 1988.11.02
申请号 AU19880014875 申请日期 1988.02.03
申请人 OLIN CORPORATION 发明人 JULIUS C. FISTER;JACOB CRANE;SANKARANARAYANAN ASHOK
分类号 C22C9/06;C22C38/08;H01L23/14;H01L23/373;H05K1/05 主分类号 C22C9/06
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