Heat sink apparatus for semiconductor devices

摘要

A unitary heat sink apparatus comprises a body of heat conductive material formed with parallel grooves (18) which define fins (14) the ratio of the height P of which to the width f of the grooves is at least 6 to 1. In one embodiment the body is formed with another series of grooves intersecting the grooves (18) and dividing the fins into a plurality of pins. A method of forming such a heat sink apparatus is also described in which the grooves are sawn into the body. In one embodiment the body is extruded with the grooves partially formed by the extrusion, whereafter their depth is increased by sawing.