| 摘要 |
PURPOSE:To remove a fine foreign matter without damaging a wafer surface by so softly contacting a micro foreign matter removing mechanism for removing the matter with the wafer that the contacting surface pressure becomes very small. CONSTITUTION:When a foreign matter exists on a wafer, a scattered light is generated when a laser light is passed and introduced through a condensing lens 6 to a photomultiplier 5. The intensity of an input to the photomultiplier 5 is proportional to the magnitude of the matter. The laser light reflected on a half mirror 8 is partly irradiated to a position sensor 9, and the positional coordinates of the matter on the wafer 12 is identified when the output of the photomultiplier 5 is corresponded to the positions of the sensor 9 and a sample stage 1. The matter on the wafer 12 is sequentially moved by moving stands 2, 3 to a micro foreign matter removing mechanism 34, and the matter is hitted and flown while a hinge 13 is being moved. In this case, since the mechanism 34 is elevationally moved by a vertically moving stand 14 to prevent the end of the mechanism 34 from contacting with the upper surface of the wafer at an unnecessary time, it can prevent the wafer 12 from damaging. |
