| 摘要 |
PURPOSE:To feed cleaning agent to the bottom of a groove formed on a semiconductor wafer surface by cleaning the surface of the wafer by a shower to which an ultrasonic vibration is applied. CONSTITUTION:A nozzle 11 is supported obliquely upward to a nozzle moving unit 12 with respect to a wafer 201 to be cleaned, secured to the upper surface of a wafer rotary supporting stand 102, provided obliquely to the wafer, the nozzle 11 is moved in parallel at its directing points from the center of the wafer to the peripheral edge, and moved at the distance to the wafer 15mm or shorter. An ultrasonic vibrator 21 is contained in the nozzle 11, and the oscillation of an ultrasonic oscillator 16 is applied by an ultrasonic cable 17 to the vibrator 21. An injection bore is formed at the nozzle 11 to supply cleanser pressurized by a pump 14 through a cleaning agent conveying hose 15. Thus, the bottom of the groove formed on the wafer surface can be cleaned.
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