| 摘要 |
PURPOSE:To improve the heat radiation properties of a printed circuit board composed of a metal board and a thin insulating layer applied to it by a method wherein a copper foil is applied to the metal board covered with an epoxy resin impregnated organic base of a specific thickness. CONSTITUTION:The thickness of the insulating layer 2 of a printed circuit board is as thin as less than 50mu and the inside of the board is composed of an epoxy resin impregnated organic base. With this constitution, a hard foundation can be obtained and further heat can be transmitted quickly to the metal board so that heat radiation characteristics can be improved. |
