发明名称 Micro-electronics devices and methods of manufacturing same
摘要 A low dielectric constant material for use in the formation of thick film circuits such as VLSI devices. The material comprises a thick film insulation matrix of standard viscosity; a thick film organic vehicle; and a plurality of dry, hollow, glass microspheres. The insulation matrix, vehicle, and microspheres are thoroughly combined into a homogeneous material of standard viscosity.
申请公布号 US4781968(A) 申请公布日期 1988.11.01
申请号 US19860834912 申请日期 1986.02.28
申请人 DIGITAL EQUIPMENT CORPORATION 发明人 KELLERMAN, DAVID
分类号 C03C17/38;C03C14/00;C08K7/16;C08K7/20;C08L101/00;C09D5/25;H01B3/02;H01L21/48;H01L23/15;H01L23/498;H05K1/03;H05K3/28;H05K3/46;(IPC1-7):B32B3/00;B32B5/16;B32B9/00;H05K1/00 主分类号 C03C17/38
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