Method and apparatus for assuring plating uniformity

摘要

A tensioning mechanism includes a frame pivotally carrying an arm at one end intermediate its length and carrying an arm fixed to the frame at its opposite end intermediate its length. Tension springs are disposed between the arms on one side of the frame and the ends of the arms on the opposite side of the frame releasably carry clamps for securing a substrate between the arms. When the substrate is clamped to the arms, the springs pivot the one arm to apply a tension to the substrate to ensure flatness and planarity of the substrate. The mechanism may then be disposed in an electrolytic bath for plating the substrate and hence defining locations for orifices to be formed in the substrate.