LEAD FRAME DEFLASHING

摘要

: The present invention relates to a technique for deflashing a molded integrated circuit package. The package is comprised of a molded central body encapsulating the semiconductor device and a plurality of electrical leads extending away from the central body, and including, in addition, residual waste molding material external of the central body and between the electrical leads. The deflashing operation is characterized by the step of exposing the residual waste molding material to a scanning laser beam in such a way that the scanning beam is nonselectively incident on both the waste molding material and one or more surfaces of the electrical leads to remove the residual waste molding material without impairing the electrical leads.