发明名称 |
Process for pretreatment before plating through-holes of printed circuit boards |
摘要 |
A pretreatment process for removing air within through-holes of printed circuit boards before plating the through-holes is provided. Air within the through-holes of the printed circuit boards is replaced with a saturated vapor of a water-soluble liquid by dipping the printed circuit board into the boiled liquid and then the saturated vapor is dissolved in water or a water-soluble liquid to remove air.
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申请公布号 |
US4781943(A) |
申请公布日期 |
1988.11.01 |
申请号 |
US19870033266 |
申请日期 |
1987.04.02 |
申请人 |
HITACHI, LTD. |
发明人 |
TOBA, RITSUJI;MUTOO, TSUNEHUMI |
分类号 |
H05K3/42;H05K3/00;(IPC1-7):B05D5/12 |
主分类号 |
H05K3/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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