| 摘要 |
PURPOSE:To realize a low profile module and make its manufacture and application easy by a method wherein circuit components are fixed to an insulating board to constitute an electronic circuit and the soldering margin of a case frame is fixed to the soldering margin of the insulating board by soldering. CONSTITUTION:A board 4 has a wiring part 3a and a circumferential soldering margin 3b for a frame. Circuit components 5 and pin-type lead terminals 7 are soldered to the wiring part 3a to constitute a required electronic circuit and a module main part 10 is formed. The soldering margin 3b for the frame is formed around the circumferential part of the board 4. The case frame 14 is made of solderable material such as copper and is a frame whose upper and lower ends are opened and whose side walls 15 surrounding the four sides have rectangular shapes. The one end 14a is put on the soldering margin 3b of the board 4 and soldered to it to constitute a case 9 whose bottom is the board 4 and whose upper end is opened and lower end is closed.
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