| 摘要 |
PURPOSE:To form a high-density multilayer flexible printed interconnection board which has a high flexibility and is easy to be produced continuously by a method wherein the upper surface and the lower surface of an inner layer material composed of a thermoplastic resin layer and circuits formed on its surfaces are coated with metal foils with resin layers between and the whole layers are unified. CONSTITUTION:Metal foils 4 are applied to the upper surface and/or the lower surface of an inner layer material composed of a thermoplastic flexible resin layer 1 and circuits 2 formed on its surfaces with resin layers 4 between and the whole layers are unified. As the flexible and bendable thermoplastic resin layer is employed as the inner layer material, the board can be applied easily to a complex shape and a complex structure such as an L-type wiring and, moreover, by providing a multilayer interconnection, a high density interconnection can be achieved. Moreover, the board can be continuously formed as the multilayer interconnection board and, by processing the outer surface metal layers by a method such as etching, flexible printed interconnection circuits can be easily formed by common processing manufacturers. |
