发明名称 MANUFACTURE OF SUBSTRATE FOR THERMAL HEAD
摘要 PURPOSE:To lower the resistance of a common electrode body, to reduce the difference in the voltage applied to a heat generating resistor according to a printing position and to improve printing density irregularity, by forming a low temp. curable conductive paste layer on the conductor layer of the common electrode part by printing and baking. CONSTITUTION:A heat generating resistor layer 2 and an Al conductor layer 3 are formed on a glazed alumina substrate 1 by a sputtering method. Next, the metal layers thus overlapped in a multilayer are etched using known photoresist technique to form a wiring pattern wherein a part of the heat generating resistor layer 2 is formed into a heat generating resistor 4, and a common electrode part 51 and an indivisual electrode part 52 are formed from the Al conductor layer 3. Next, a low temp. curable silver paste layer 6 is printed on the predetermind region of the common electrode part 51 where it is necessary to reduce conductor resistance by a screen printing method and baked. Subsequently, an SiO2 film is formed as an abrasion resistant layer 7 and, at last, the electrode parts 51, 52 are coated with an insulating resin film 8 by a screen printing method to obtain an objective thermal head substrate.
申请公布号 JPS63264370(A) 申请公布日期 1988.11.01
申请号 JP19870098825 申请日期 1987.04.21
申请人 NEC CORP 发明人 TACHIKI SHIGEMI
分类号 B41J2/335 主分类号 B41J2/335
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