发明名称 SOLDERING METHOD
摘要 PURPOSE:To form a solder film on the lead surface of a work where leads are projected in plural directions by executing the stage drying the work by dipping it in a creamy solder in plural times by rotating the work and subjecting to melting treatment with vapor bath heating. CONSTITUTION:The stage 11 coating a creamy solder on the lead L1 located at the lower part of a work W by dipping it in the creamy solder 52 and the creamy solder coated on this lead L1 is dried at a stage 12. The lead L2 on the adjacent side is located at the work lower part by rotating 90 deg. the work W at a stage 13 and at a stage 14 the work W is descended and the lead L2 is dipped into a solder 52 to coat the solder. The solder coated at a stage 15 is dried. A solder is coated on the leads L1-L4 of the work W by repeating said process in order, pre-heated at a stage 22 and the creamy solder of the leads L1-L4 is subjected to melting treatment with vapor bath heating at a stage 23. And a residual flux, etc., are cleaned at a stage 24.
申请公布号 JPS63264269(A) 申请公布日期 1988.11.01
申请号 JP19870098380 申请日期 1987.04.21
申请人 TAMURA SEISAKUSHO CO LTD 发明人 ABE NOBUHIDE;TAKAHASHI TAKAO;HIRONO SHUNICHI
分类号 B23K1/015;B23K1/20;B23K3/00;B23K3/04;B23K3/06;H05K3/34 主分类号 B23K1/015
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