| 摘要 |
PURPOSE:To obtain the title composition which has any desired dielectric constant and give a molding excellent in heat resistance, chemical resistance, dimensional stability and physical strengths, by mixing a polyphenylene oxide with a crosslinkable polymer and/or a crosslinking monomer and an inorganic filler. CONSTITUTION:10-95pts.wt. polyphenylene oxide (A), 1-90pts.wt. crosslinkable polymer (B) such as a styrene/butadiene copolymer and/or crosslinking monomer (C) such as triallyl (iso)cyanurate, 1-200pts.wt. inorganic filler (D) (e.g., Al2O3 powder) of a particle size <=50mu and, optionally, 0.1-5pts.wt. initiator (E) such as dicumyl peroxide are dissolved in a solvent (F) (e.g., trichloroethylene) so that the concentration of the resulting solution may be 5-50wt.%, this solution is cast or applied to form a thin layer, and this layer is solidified by drying and desolventation. |
