| 摘要 |
PURPOSE:To facilitate reducing the possibility of peeling off of the insulation of an element board and eliminate a mechanical processing of the element board practically after a process of insulation coating and form the element board with a high yield by a method wherein breaking grooves whose residual thickness is specified are provided at predetermined positions of an electrical metal substrate for forming a plurality of element boards with a specific thickness before the metal substrate is coated with insulation. CONSTITUTION:Breaking grooves 2 for forming element boards 4 are provided in a metal substrate 1 with a thickness, for instance, less than 2 mm. The breaking groove 2 is formed by a press process or a laser process so as to make a right angle between the two walls of the grooves. The thickness of the breaking groove 2 is 0.2 mm when it is formed on one side of the metal substrate 1 and 0.1 mm when it is formed on both sides of the metal substrate 1 and the groove 2 is so formed as to make its residual thickness 1/20 3/4 mm. After the metal substrate 1 formed like this is coated with insulator, the breaking process is performed to form the respective element boards 4.
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