| 摘要 |
PURPOSE:To test the state of a wafer and a finished chip by the same measurement system by arranging an insert ring upside down under the state, in which a probing card is fixed, disposing a connecting member to the upper section of the card and connecting the card to the IC chip. CONSTITUTION:A hole such as a circular through-hole 3a is formed at the central section of a probing card 3, a large number of probes 3c are implanted obliquely toward a lower section to the periphery of the through-hole 3a on the underside 3b of the card 3, and the probes 3c are connected electrically to a connecting section 3f in a top face by using a conductor pattern. The connecting section 3f is also connected to a connecting section 3g. The card 3 is arranged onto a test head 1 together with an insert ring 2 while the connecting section 3g is directed upward, and a connecting member 6 is disposed onto the card 3. An IC chip 7 is arranged to an IC socket 6c for the member 6. Accordingly, the IC chip 7 as a finished product can be tested and measured by the same measurement system as a test is conducted under the state of a semiconductor wafer.
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