| 摘要 |
<p>PURPOSE:To enable the chipping as well as the photodetecting pitch difference at the connection part to be minimized by a method wherein the relative positions of a line of dicing blade passing target and protective films are restricted to decide the structure as dicing scribe line. CONSTITUTION:A line 101 as a passing target of dicing blade is made of an element forming material such as aluminium on a substrate 102 whereon a semiconductor element 103 etc., is provided and then exceeding respectively one layer of non-organic material and organic material as protective films are provided. At least one layer of protective films 104, 106 made of non-organic material is provided on the position exceeding 1 mum and not exceeding 20 mum from line on the side layer wherein no dicing blade passes through while at least one layer of protective film 105 made of organic material is not provided on the position exceeding 1mum and not exceeding 20 mum on the oppositive side of line as a passing target from the boundary line of non-organic material nearest to the substrate. Thus, the chipping size can be notably lowered to provide an element close to the dicing line. Through these procedures, the shift of photodetector pitch can be minimized at the connection part.</p> |
