| 摘要 |
PURPOSE:To obtain a device, which is of one-layered wiring structure, small in size through disposing driver ICs together at one side of an LLA by a method wherein a vacant path is provided between the LLA and a substrate in which a submerged film wiring passing through under the LLA is built. CONSTITUTION:A light emitting diode array (LLA) 11 is provided along in a lengthwise direction on a rectangular ceramic substrate 14. The LLA is wire- bonded to each film wiring layer 13, which is provided at both sides of the LLA on the substrate 14, through its upper electrode and a vacant path 25 is provided between the LLA and the substrate 14. A submerged film wiring layer 26, which passes through under the LLA 11 to connect the film wiring 13 formed at the other side of the LLA on the substrate 14, is provided on a part of the substrate 14 which constitutes a part of the vacant path 25. By these processes, though a device of this design is of one-layered wiring structure, the device can be rendered small owing to disposing driver ICs at one side. |
