| 摘要 |
<p>PURPOSE:To make it possible to miniaturize a ceramic substrate provided with the semiconductor elements in a recessed section with low cost by getting the aforesaid semiconductor elements sealed airtightly after confronting one another in the inside, eliminating a cover, reducing the material cost only for the cover and succeeding in the sealing work at an attempt. CONSTITUTION:Two of ceramic substrates 1 can be obtained by positioning after confronting the semiconductor elements 2 so as to not bring them into contact each other, heating by means of a solder 6, fixing the enclosing walls 1b one another and sealing a package airtightly. According to the constitution, a cover normally being used can be eliminated and also the title device is miniaturized.</p> |
