| 摘要 |
PURPOSE:To enable the uniform formation of a film on the entire surface of a substrate by providing a means of gripping a part of the beveled part of the substrate, oscillating the substrate in the perpendicular direction and rotating the substrate on its axis during film formation. CONSTITUTION:A substrate is transferred to an automatic unit 6 for oscillating the substrate in a sputtering chamber 2 by an arm 3 for transfer in a load lock chamber 1. The unit 6 grips a part of the peripheral beveled part of the substrate and oscillate the substrate to a position at which the substrate confronts a target 5 at a certain interval. The substrate is then rotated on its axis by a motor 8, and while the substrate is rotated, sputtering is carried out. Thus, a film of a uniform thickness can be formed on the entire surface of the substrate without deteriorating the quality.
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