| 摘要 |
<p>PURPOSE:To facilitate the handling of pellets and to improve manufacturing yield, by forming grooves in scribing regions on the surface of a semiconductor substrate, bonding a support substrate on the surface thereof and polishing the rear face of the semiconductor substrate for making the grooves pass through. CONSTITUTION:Grooves 3 are formed on the surface of a semiconductor substrate 1 by means of a dicer. The semiconductor substrate 1 is bonded to a support substrate 4 such as a glass plate with its surface having the grooves faced to the support substrate 4. The rear face of the semiconductor substrate 4 thus bonded to the support substrate is polished or etched until the grooves 3 pass through. Thereby, It is made possible to decrease the dimensions of scribing regions for dividing the substrate into the pellets of semiconductor elements having via holes 6 and, therefore, the yield of pellets can be improved.</p> |
