| 摘要 |
PURPOSE:To make it possible to remove simply enbloc chips or lamination chips having form defects and characteristic defects developed in the outer peripheral parts of a wafer, by cutting a retaining plate at the same time with the cutting of wafer or wafer lamination column, and removing the outer part of the retaining plate. CONSTITUTION:On a retaining plate 2, the bottom surface of a wafer lamination column 3 is stuck with wax in the concentric manner with a ring type groove 4. Then the wafer lamination colum 3 is diced in the axial direction. This cutting is performed form the mating surface side of the wafer lamination column 3 up to the depth where the retaining plate 2 reaches the bottom of the ring type groove arranged on the lower surface of the retaining plate 3. By this cutting, the retaining plate 2 is divided into an inner part 2a and an outer part 2b of the ting type groove at the same time when the wafer lamination column 3 is cut into lamination chips. The outer part 2b of the retaining plate to which lamination chips 3b situated at the outer periphery of the wafer lamination column are stuck is removed. Thereby, lamination chips whose from and characteristics are defective are simply removed enbloc. |
