| 摘要 |
PURPOSE:To prevent the possibility of a short-circuit when a wire bonding is performed by a method wherein the point of a lead on which a wire bonding will be performed is made lower than the circumferential point. CONSTITUTION:The point 9 to be wire-bonded of the lead 5 on a lead frame is positioned lower than the circumferential point 10. When a capillary 7 is moved to the point 9 where a wire-bonding will be performed, the part 11 of a conductive wire 6 is pushed upward in order to let the part corresponding to an arc 8 to come in contact with the circumferential part 10 when a capillary is moved to the point 9 where a wire bonding is performed. As a result, the interval between a semiconductor chip and a conductive wire 6 is widened, thereby enabling to prevent the possibility of a short-circuit. |
