| 摘要 |
PURPOSE:To improve the thioxotropy of the titled composition, and to make the film thickness of the titled composition mounted on a wiring plate uniform by incorporating an org. clay and/or a hydrophobic hyperfine particulate silica and a hydrophobic fine particulate filler, and a prescribed coupling agent, in the titled composition. CONSTITUTION:The titled composition contains a photopolymerizable unsatd. compd. (A), a sensitizer (system) capable of forming a free radical by an active ray, and the org. clay (B) and/or the hydrophobic hyperfine particulate silica (C) and the hydrophobic fine particulate filler (D) and one or more kinds of silane type, titanate type or aluminium type coupling agent (E) and a novolak type epoxy resin. The compd. (A) is formed by allowing a prescribed amount of a reaction product of the novolak type epoxy resin and an unsatd. carboxylic acid to react with a prescribed amount of a monovalent isocyanate. The titled composition comprises a smectite clay modified so as to have affinity for an org. compd., as the clay (B), and a silica modified to give hydrophobic property to a silanol group existing on a surface of the silica as the silica (C), and the inorg. filler which is effected the surface treatment with a coupling agent (E) as the filler (D). |
