| 摘要 |
PURPOSE:To obtain a copper-clad laminate excellent in heat resistance, measling resistance, dimensional stability and soldering heat resistance, by using a mixture of an epoxy resin prepared by using bisphenol A-containing phenol as a starting material with a high-MW cresol/novolac resin as a laminating resin. CONSTITUTION:A copper-clad laminate obtained by integrally molding an assemblage obtained by laminating prepregs formed by impregnating bases with an epoxy resin composition prepared by mixing 1 equivalent (in terms of epoxy groups) of an epoxy resin (A) which is a glycidyl ether of a condensation product of a phenol at least partially consisting of bisphenol A with formaldehyde with 0.5-1.5 equivalent (in terms of phenolic hydroxyl groups) of a linear high-MW cresol novolac resin (B) of a number-average MW>=1,500 with a copper foil by application of heat and pressure. The copper-clad laminate is excellent in heat resistance, measling resistance, and soldering heat resistance and particularly suited for multilayer printed wiring boards and surface mounting. |
