发明名称 TREATMENT APPARATUS
摘要 PURPOSE:To improve the treatment efficiency and reliability of products by dividing tape bases that are works in the form of strip for each prescribed length and by treating the works in a state where they are cut into strips, thereby joining strips of work to a series of tape-like ones once more. CONSTITUTION:Tape-like semiconductor devices 5 which are fed out of a product reel 12 are fed to a cutting head 18 and tape bases 6 are divided with a cutter 20 in the form of strips having a constant length. The semiconductor devices 5 which are held by a vacuum suction effect of a sticking head 22 are moved to the side of unloader 23 and an aging treatment is performed for a prescribed time. After that, they are moved to a tape sticking part and end parts of tape bases 6 are joined each other with a self-adhesive tape 34 made from polyimide resin which is supplied by an adhesive tape reel. In this way, the semiconductor devices 5 which were treated again so that they may have tape-like forms are wound once more to the product reel 12 together with a spacer tape 14.
申请公布号 JPS63260043(A) 申请公布日期 1988.10.27
申请号 JP19870093038 申请日期 1987.04.17
申请人 HITACHI LTD 发明人 OKAMOTO MICHIO;NAKANISHI MASAKI;OMORI ISAO
分类号 H01L21/66;G01R31/26;G01R31/30;H01L21/60 主分类号 H01L21/66
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