| 摘要 |
PURPOSE:To supply hard solder in a prescribed area almost to the uniform thickness by supplying adhesive materials from a part other than a plane of porous materials facing to a base substance part and by causing the adhesive materials to be supplied to the base substance after being exuded from the plane of the porous materials facing to the base substance part, thereby placing and fixing semiconductor elements to the base substance part. CONSTITUTION:A porous substance 12 which is manufactured into a pre-determined size is held by a holder 13 at an upper part of a base substance 11 for fixing an element. This holder 13 connects to a soft solder housing container (syringe) 15 which is attached to a quantitative discharge device 14 at the opposite part of the holder 13 from the attachment plane of the porous substance 12. Once air is discharged from the quantitative discharge device 14 in this state, air pressure is transmitted almost uniformly into soft solder. Then soft solder is uniformly supplied to the whole surface of the porous substance 12. The amount of soft solder supply to the base substance 11 for fixing the element is freely controlled by making the porous substance 12 come into slight contact with the base substance 11.
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