| 摘要 |
<p>A method of manufacturing a package, for an electronic device, comprises the steps of, providing a quantity of finely divided glass having a sintering temperature of up to 730 DEG C., coating a plurality of metallic leads 10 (Fig. 2, not shown) with an adherent coating of gold having a thickness ranging from about 0.00035 inch to 0.00065 inch, compacting the finely divided glass about the leads to form a body 12 for the package, the body 12 having a large planar bottom wall 14 with a rim 16 at the periphery thereof defining a cavity, the leads extending from within the cavity to the outside of the body 12, and firing the body so formed at the sintering temperature of the glass so that the body 12 becomes substantially impervious to moisture and is hermetically sealed to the leads, and whereby the gold is substantially unaffected by the firing. An electronic device 18 may then be placed in the cavity and attached to the leads 10 by wires 20, a cover 22 then being placed over the cavity and hermetically sealed to the rim 16. The powdered glass used may be the same as that disclosed in Specification 909,660. The leads 10 are preferably made from iron, nickel, or an alloy thereof.</p> |
