| 摘要 |
An apparatus is used to machine workpieces, in particular wafers (19), in a wet cell in a semiconductor production clean room (10). A handling device (39) has a multiplicity of movement units (49, 54) for one movement axis (55, 56) in each case. The movement units (49; 54) comprise in each case a base section (40, 41, 42; 51), a drive element (47, 48; 52) and a travelling part (46, 50, 60) which can be moved relative to the base section (40, 41, 42; 51) by means of the drive element (47, 48; 52). Of the travelling parts, one (60) is provided with a gripper (61) for gripping the wafer (19). Situated in the working area of the handling device (39) is a machining device with stacking stations (20) and processing stations, in particular baths (14, 14a). In order to provide an apparatus which is as simple as possible and is optimised from the point of view of particle deposition and which ensures as great a freedom as possible from particles in the movement area of the wafer (19), the stacking stations (20) and the machining stations are situated at least approximately in one plane and the base sections (40, 41, 42; 51) and the drive elements (47, 48; 52) of all the movement units (49; 54) are arranged below the plane (Figure 1). <IMAGE>
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