| 摘要 |
PURPOSE:To prevent light from attenuating or so due to each light transmission factors and to prevent sensitivity from being lowered due to shortage in the quantity of light into a sensor, by junctioning a sensor chip on a side of a circuit board, where the sensor chip is driven and a signal from the sensor chip is processed, in a module structure of an adhesion type image sensor and next by mounting the juncture on the circuit board. CONSTITUTION:A group of electronic components 2, which form a circuit where a sensor is driven and a signal from the sensor is processed, are junctioned on a printed circuit board 1 by the use of solder 3 or the like. A sensor chip 4 is junctioned on a side of the printed circuit board 1 in this circuit block A by the use of an adhesive 31. A wire bonder and a bonding wire 8 are used to electrically junction a bonding pat 6 of the sensor chip with a bonding pat 7 for wiring on the printed circuit board 1. In succession, a molding agent 10 is provided to compose a sensor module. Since an organic material is not contained in an incident optical path, accordingly a stable sensor characteristic can be maintained to be very small in a change of its transmission factor with the lapse of time.
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