发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To improve the sensitivity, the resolution and the oxygen plasma durability of the titled composition by using a specified polyorganosilsesquioxane type polymer and a photosensitive solution inhibitor for the titled composition. CONSTITUTION:The composition contains the alkali-soluble polyorganosilses quioxane type polymer (A) which is an org. group contg. a phenolic hydroxy group in one or more of side chains and the photosensitive solution inhibitor (B) as a main component. And, the polymer A is preferably the polymer shown by formula (I) [wherein R1-R6 are each preferably a group shown by formulas II-VII. (l)-(q) are each a positive integer]. And, the inhibitor B is preferably o-quinone diazide shown by formula VIII (wherein R7 is a monovalent org. group). Thus, the titled composition which is suitable for an alkali developing method and is applicable to the upper layer resist in two layers resist method is obtd.
申请公布号 JPS63261255(A) 申请公布日期 1988.10.27
申请号 JP19870095164 申请日期 1987.04.20
申请人 HITACHI LTD 发明人 SUGIYAMA HISASHI;NATE KAZUO;INOUE TAKASHI;MIZUSHIMA AKIKO
分类号 G03C1/72;G03F7/075 主分类号 G03C1/72
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