| 摘要 |
PURPOSE:To obtain the title composition which has low modulus, excellent heat shock resistance and heat resistance and does not foul a mold, by separating part of the constituents from a specified silicone elastomer, mixing the resulting silicone elastomer with a phenolic resin and mixing the obtained mixture with an epoxy resin. CONSTITUTION:A silicone elastomer composed of a silanol group-terminated organopolysiloxane (A) of formula I (wherein n>=10 and R is a monovalent hydrocarbon group), e.g., a compound of formula II, a crosslinking agent (B) for silanol condensation (e.g., methyltrimethoxysilane) and a silanol condensation catalyst (e.g., dibutyltin dilaurate) is prepared. At least one of these components A, B and C is separated from this silicone elastomer, and the resulting silicone elastomer is dispersed in a phenolic resin. The obtained phenolic resin is mixed with an epoxy resin to obtain a thermosetting epoxy resin composition suitable for sealing electric components, etc.
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