发明名称 METHOD FOR ADHERING METAL TO RESIN
摘要 PURPOSE:To form a metal layer having high adhesive strength to resin with high work efficiency by simultaneously carrying out the plasma polymn. of an org. monomer and the vapor deposition of a metal on a resin layer to form an adhesive layer and by vapor-depositing a metal on the adhesive layer. CONSTITUTION:A metal such as copper on an evaporating dish is evaporated by heating in a reactor. At the same time, an org. monomer is plasma- polymerized in the reactor to form an adhesive layer 2 consisting of a polymer 2a and particles 2b of a vapor-deposited metal such as copper on a resin layer 1. During the formation of the layer 2, the amt. of the org. monomer is gradually reduced so as to continuously vary the compsn. of the layer 2. The top of the layer 2 is preferably composed of the particles 2b. When the resin layer 1 is made of polyimide, aniline or acrylonitrile is suitable for use as the org. monomer. A metal is then vapor-deposited on the adhesive layer 2 to form a metal layer 3. This metal layer 3 is adhered to the resin layer 1 with the adhesive layer 2 in-between with high adhesive strength.
申请公布号 JPS63259069(A) 申请公布日期 1988.10.26
申请号 JP19870093980 申请日期 1987.04.16
申请人 SUMITOMO ELECTRIC IND LTD 发明人 KASHIWAGI TORU;HARA KOJI;KUNO MINEYA
分类号 B32B15/08;C23C14/02;C23C14/06;H05K3/14;H05K3/38 主分类号 B32B15/08
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