Process for laser welding of aluminium based elements.

摘要

A process for laser welding a cover (1) and a casing (2), each made of aluminium or an aluminium based alloy, via a plated nickel layer to form a package for electronic devices, comprising the steps of: boring holes in the sides of the casing (2), thereby providing holes through which input/output (3) and source (4) terminals can be inserted and be soldered hermetically to the casing; plating a nickel layer (5) on the surface of the casing (2); mounting electronic devices in the casing and forming necessary connections between the devices and the terminals; and, welding the cover (1) and the casing (2) together by pulsed YAG laser beam, thereby sealing the cover and the casing hermetically and forming a weld zone of nickel. Preferably the weld zone contains between 1.5 and 10% of nickel by weight and preferably a layer of between 2.5 and 10 mu m of nickel is deposited on the surface of the casing (2).