发明名称 MANUFACTURE OF SEMICONDUCTOR LASER DEVICE
摘要 PURPOSE:To obtain a semiconductor laser device whose operating characteristics are good by completely removing an electric-current constriction layer of a second conductivity type at the bottom of a stripe-shaped groove by etching a region from the electric-current constriction layer down to at least a boundary layer of a first conductivity type. CONSTITUTION:A first clad layer 2, an active layer 3, a second clad layer 4, a boundary layer 11 and an electric-current constriction layer 5 are formed in succession on a substrate 1 by using an MOCVD method. Then, an etching operation is executed down to the surface of the second p-type clad layer 4; a stripe-shaped groove 10 is formed along the direction of a resonator. Then, two layers, i.e., a buffer layer 6 and a contact layer 7, are formed on the second clad layer 4 and on the electric-current constriction layer 5. Lastly, an n-side electrode 8 is formed on the side of the substrate 1 and a p-side electrode 9 is formed on the side of the contact layer 7; a semiconductor laser device is completed. By this setup, this device operates with good characteristics without causing any intermittent oscillation.
申请公布号 JPS63257289(A) 申请公布日期 1988.10.25
申请号 JP19870092714 申请日期 1987.04.14
申请人 MITSUBISHI ELECTRIC CORP 发明人 OTA YOICHIRO;YAGI TETSUYA;NAGAI YUTAKA;MIHASHI YUTAKA
分类号 H01S5/00 主分类号 H01S5/00
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