发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To reduce the cost of a metal mold by a method wherein recessed parts accommodating leads separately one by one are shaped to be straight-line grooves which are parallel with sides of a package so that an uneven part on the bottom of the package is reduced as far as possible and that a metal can be machined easily. CONSTITUTION:Straight-line grooves 10a, 10b, 10c and the like which commonly accommodate tip parts of groups of leads 7a, 7b, 7c and the like protruded from sides of a package 5 are formed inside protruded parts 8 on the bottom of the package 5. The tip parts of individual leads 7 cannot be moved in the longitudinal direction due to wall panels which constitute the grooves 10. By this setup, an uneven part on the bottom of the package 5 is reduced as far as possible; a metal can be machined easily; the cost of a metal mold is reduced.
申请公布号 JPS63257252(A) 申请公布日期 1988.10.25
申请号 JP19870090871 申请日期 1987.04.15
申请人 HITACHI LTD;HITACHI HOKKAI SEMICONDUCTOR LTD 发明人 YOSHIDA KAZUAKI
分类号 H01L23/28;H01L23/50 主分类号 H01L23/28
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