| 发明名称 |
Mold for transfer molding |
| 摘要 |
A mold for transfer molding having a cavity block in which a mold injected with resin is formed and a templet for holding the cavity block, in which a liquid layer is provided between the templet and a support member for supporting the templet, whereby the templet can be moved up and down on the liquid layer at its respective portions.
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| 申请公布号 |
US4779835(A) |
申请公布日期 |
1988.10.25 |
| 申请号 |
US19860903562 |
申请日期 |
1986.09.04 |
| 申请人 |
SONY CORPORATION |
发明人 |
FUKUSHIMA, YUICHI;KOBAYASHI, FUJIO;TAKAHASHI, SHINICHIRO |
| 分类号 |
H01L21/56;B29C45/02;B29C45/14;B29C45/17;B29C45/26;B29K101/10;B29L31/34;(IPC1-7):B29C45/04;B29C45/03 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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