| 摘要 |
PURPOSE:To manufacture an integrated circuit device to be operated at high speed without increasing the containing density of outer leads by a method wherein the feed-through termination system is adopted in principle while the wiring parts are laminated in the thickness direction of holding substrate to fix the matched resistance to outer wall surface of package. CONSTITUTION:The first wiring part 4 in specified impedance with one end and the other end respectively connected to an outer lead 3 and an input terminal of integrated circuit chip 2 as well as the second wiring part 6 in specified impedance with one end led to the outside of a package and the other end connected to an input terminal of said chip 2 are arranged on said chip 2, the package enclosing the chip 2 and a holding substrate 1 of the package. Furthermore, a matched resistance 8 connected to one end of outer package of the second wiring part 6 fixed to the outer wall surface of package and a conductor film 9 connected to the other end of matched resistance 8 to supply said chip 2 with terminal potential are provided. The first and the second wiring parts 4, 6 are to be laminated and arranged through the intermediary of i.e. an insulator. |
