发明名称 |
Method of producing printed circuit boards |
摘要 |
A method of producing printed circuit boards comprises the steps of applying a first solder resist on the conductor circuit pattern so as to surround lands to be soldered in the pattern and then applying a second solder resist to the whole surface of the pattern so as to leave portions having a size larger than the size of the land and smaller than the outer diameter of the first solder resist.
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申请公布号 |
US4779339(A) |
申请公布日期 |
1988.10.25 |
申请号 |
US19870047151 |
申请日期 |
1987.05.06 |
申请人 |
NIPPON CMK CORPORATION |
发明人 |
OHTANI, YASUAKI;BIRUKAWA, FUSAO |
分类号 |
H05K1/11;H05K3/34;(IPC1-7):H05K3/10 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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