发明名称 Method of producing printed circuit boards
摘要 A method of producing printed circuit boards comprises the steps of applying a first solder resist on the conductor circuit pattern so as to surround lands to be soldered in the pattern and then applying a second solder resist to the whole surface of the pattern so as to leave portions having a size larger than the size of the land and smaller than the outer diameter of the first solder resist.
申请公布号 US4779339(A) 申请公布日期 1988.10.25
申请号 US19870047151 申请日期 1987.05.06
申请人 NIPPON CMK CORPORATION 发明人 OHTANI, YASUAKI;BIRUKAWA, FUSAO
分类号 H05K1/11;H05K3/34;(IPC1-7):H05K3/10 主分类号 H05K1/11
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