发明名称 WIRE BONDING
摘要 PURPOSE:To enhance the reliability and productivity by a method wherein the basic acceleration in the X-Y direction and in the Z direction is changed and the arrival timing in the X-Y direction and in the Z direction of a capillary in the neighborhood on a second bonding point is controlled. CONSTITUTION:When a capillary 4 is shifted to a second bonding point B which is situated at a distance L from a first bonding point A, the arrival timing in the X-Y direction and in the Z direction is controlled when the capillary arrives at a point C situated at a vertical distance a from the point B. That is to say, while the capillary 4 is shifted in an equal acceleration waveform in the X-Y direction and in the Z direction, the waveform in the X-Y direction is set to be definite and the waveform in the Z direction is changed. If a wire bonding operation is controlled in this manner, a wire is pulled in the transverse direction by a distance S just before a second bonding point according to a locus similar to a triangle; accordingly, the slack of a wire loop is removed and it is possible to obtain a wire loop shape where the loop is situated at a comparatively low position.
申请公布号 JPS63257236(A) 申请公布日期 1988.10.25
申请号 JP19870092716 申请日期 1987.04.14
申请人 MITSUBISHI ELECTRIC CORP 发明人 OKAMURA MASAMITSU;OSHIGE TOYOMI;ICHIMURA HIDEO
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址