| 摘要 |
PURPOSE:To obtain the title transferring device causing no transfer error by a method wherein wafers are lined up in parallel with each other by providing a tilt-angle adjusting means in a wafer transfer mechanism, and the tilt angle of the wafers and the tilt angle of the wafer transfer mechanism coincide with each other. CONSTITUTION:A means 10, with which the entire device will be tilted at a predetermined angle in order to line up wafers 1 at a fixed pitch in a cassette 2 and on a boat 3, is provided in the device having a mechanism which transfers semiconductor wafers 1 between the cassette 2 and the boat 3. Moreover, a tilt-angle adjusting means is provided on a wafer transfer mechanism 6 for the purpose of preventing the wafers 1 from tilting in excess of the tilt angle of the entire device caused by the wafer housing groove of the cassette 2 and the boat 3, formed larger than the thickness of the wafers 1, For example, a supporting point 11, with which the transfer device 6 will be tilted between the base 6a of the transfer device 6 and a tilting plate 7a, is provided on the base 6a of the transfer device 6, and after the tilt angle of theta+ theta has been adjusted by an adjusting screw 12, the transfer device base 6a and the tilting plate 7a are fixed using a bolt 13.
|
