| 摘要 |
PURPOSE:To make it possible to fully fulfill the high-speed efficiency of an integrated circuit using a package of a constant impedance wiring structure by a method wherein the part extending from the internal wiring of the package to an external lead is constituted of a flexible wiring structure, wherein conductor films are each formed on both surfaces of resin layers comprising signal wiring layers buried in their interiors. CONSTITUTION:A package main body consisting of a semiconductor integrated circuit chip 1, a supporting base body 2, wherein the chip 1 is sealed, and a sealing base body 3 is provided. A flexible wiring structure 4, wherein upper and lower conductor films 413 and 411 are provided on resin layers 421 and 422 buried in with a plurality of signal wiring films 412, is provided as a wiring body, which is pinched between the above base bodies 2 and 3 and also serves as the wiring in the package and an external lead. The structure 4 is, for example, constituted by a method wherein the 70 mum thick polyimide film 421 and the signal wiring 412 consisting of a copper foil of 18 mum are laminated in order on the 35 mum thick copper foil 411 and moreover, the 70 mum thick polyimide film 422 and the 35 mum thick copper foil 413 are laminated on the signal wiring 412.
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