| 摘要 |
PURPOSE:To cut out the limit to the chip space of semiconductor device enforced in the conventional semiconductor device for miniaturizing the chip space by a method wherein the surface of rectangular semiconductor substrate is divided into multiple regions by a strip region traversing the rectangle to form specified transistor circuit blocks in respective rectangular regions. CONSTITUTION:The surface of rectangular semiconductor substrate 1 is divided into multiple rectangular regions by a strip region 2 perpendicular to either one side thereof and traversing the rectangle to form specified transistor circuit blocks 3, 4 in respective rectangular regions. Then, respective transistor circuit blocks 3, 4 are electrically connected by multiple wiring patterns 5 traversing the strip region 2 so that the functions of whole circuit block may be compounded to function as a semiconductor device. Through these procedures, one chip of semiconductor device can be printed per respective blocks to be transferred resultantly expanding the space of semiconductor device twofold of one time exposure area of reduction projection exposure device. Furthermore, even if the exposure area is narrowed for miniaturization, the chip space need not be reduced. |
